Sa-Yoon Kang

This inventor holds 29 USPTO granted patents, primarily in Semiconductor Packaging. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2002-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sa-Yoon Kang. Retrieved from https://idiyas.com/inventor/sa-yoon-kang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 29

% Patents Active = 72.4

Average Co-Inventor Count = 3.5

ph-index = 8

Forward Citations = 492(Granted Patents)

Location History:

Kyungki-do, KR (2003 - 2004)
Seould, KR (2004)
Seoul, KR (2002 - 2017)

Company Filing History:

29 out of 132,108

Samsung Electronics Co., Ltd.

patents

Years Active: 2002-2017

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Areas of Expertise:

Tape Wiring Board

Chip-On-Film Package

Display Driver Circuit

Heat Dissipating Member

Flexible Printed Circuit

Wafer Level Package

3D Multi-Chip Package

Semiconductor Chip

Reinforced Bond-Pad

Electronic Apparatus

Circuit Film

Low-Cost Film Package

29 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9570400 - Semiconductor package (2017-02-14),

2. 8575746 - Chip on flexible printed circuit type semiconductor package (2013-11-05),

3. 8250750 - Method for manufacturing tape wiring board (2012-08-28),

4. 8222089 - Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same (2012-07-17),

5. 7999341 - Display driver integrated circuit device, film, and module (2011-08-16),

6. 7948768 - Tape circuit substrate with reduced size of base film (2011-05-24),

7. 7915727 - Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same (2011-03-29),

8. 7895742 - Method for manufacturing tape wiring board (2011-03-01),

9. 7732933 - Semiconductor chip and TAB package having the same (2010-06-08),

10. 7683476 - Semiconductor package film having reinforcing member and related display module (2010-03-23),

11. 7683471 - Display driver integrated circuit device, film, and module (2010-03-23),

12. 7599193 - Tape circuit substrate with reduced size of base film (2009-10-06),

13. 7375426 - Semiconductor package (2008-05-20),

14. 7339262 - Tape circuit substrate and semiconductor apparatus employing the same (2008-03-04),

15. 7329597 - Semiconductor chip and tab package having the same (2008-02-12),

Title: Sa-Yoon Kang: Pioneering Inventor from Seoul

Introduction: Sa-Yoon Kang is a distinguished inventor hailing from Seoul, South Korea, known for his groundbreaking contributions to various technological fields.

Latest Patents: Sa-Yoon Kang holds several patents in the areas of electronics, robotics, and artificial intelligence, showcasing his innovative mindset and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Sa-Yoon Kang has worked with leading tech companies in South Korea, spearheading research and development projects that have led to significant advancements in the industry.

Collaborations: Throughout his career, Sa-Yoon Kang has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge sharing.

Conclusion: Sa-Yoon Kang's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a trailblazer in the world of technology, inspiring the next generation of inventors to push the boundaries of what is possible.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]