Samsung Electronics Co., Ltd.

Sa-Yoon Kang

Donghan Kim

Si-hoon Lee

Yong-Hwan Kwon

Chung-Sun Lee

Ye-chung Chung

Gu-Sung Kim

Kyoung-sei Choi

Kyoung-Sei Choi

Dong-Hyeon Jang

Min-Young Son

Si-Hoon Lee

Dae-woo Son

Seok-Won Lee

Sang-Ho Park

Byung-seo Kim

Kyong-Soon Cho

Young-sang Cho

Kwan-Jai Lee

Sang-Gui Jo

Ye-Chung Chung

Suk-Chae Kang

Sang-Heui Lee

Young-jae Joo

Jeong-kyu Ha

Yong-hwan Kwon

Seo-hyun Cho

Myung-song Jung

In-Ku Kang

Jin-Hyuk Lee

Jeong-Seon Kim

Myung-Kee Chung

Hye-Soo Shin

Eun-Seok Cho

Hyeong-Seob Kim

Yun-hyeok Im

Ji-Yong You

Dae-Woo Son

Dong-Whee Kwon

Jae-cheon Doh

Bo-Na Baek

Provided is semiconductor package, including a semiconductor chip; an upper structure over the semiconductor chip, the upper structure having a first thermal expansion coefficient; and a lower structure under the semiconductor chip, the lower structure having a second thermal expansion coefficient of less than or equal to the first thermal expansion coefficient.

Semiconductor package

A Chip on Flexible Printed Circuit (COF) type semiconductor package may include a flexible film, a semiconductor IC chip on the flexible film, and a heating pad on the flexible film.

Chip on flexible printed circuit type semiconductor package

A method for manufacturing a tape wiring board in accordance with the present invention may employ an imprinting process in forming a wiring pattern, thereby reducing the number of processes for manufacturing a tape wiring board and allowing the manufacturing process to proceed in a single production line. Therefore, the manufacturing time and cost may be reduced. A profile of the wiring pattern may be determined by the shape of an impression pattern of a mold. This may establish the top width of inner and outer leads and incorporate tine pad pitch. Although ILB and OLB process may use an NCP, connection reliability may be established due to the soft and elastic wiring pattern.

Method for manufacturing tape wiring board

Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component.

Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same

A rectangular display driver integrated circuit device adapted for use with a flat panel display (FPD) device is disclosed and comprises, a plurality of input pads arranged in a central portion of the display driver integrated circuit device, and a plurality of output pads arranged along edges of all four sides of the display driver integrated circuit device. An associated film, film package, and flat panel display (FPD) module adapted to receive the display driver integrated circuit device are also disclosed.

Display driver integrated circuit device, film, and module

A tape circuit substrate includes a base film with first wiring and second wiring disposed on the base film. The first wiring extends into a chip mount portion through a first side and bends within the chip mount portion toward a second side. The second wiring extends into the chip mount portion through a third side and bends within the chip mount portion toward the second side. The first, second, and third sides are different sides of the chip mount portion. Thus, size and in turn cost of the base film are minimized by arranging wirings within the chip mount portion for further miniaturization of electronic devices, such as a display panel assembly, using the tape circuit substrate.

Tape circuit substrate with reduced size of base film

A method for manufacturing a tape wiring board in accordance with the present invention may employ an imprinting process in forming a wiring pattern thereby reducing the number of processes for manufacturing a tape wiring board and allowing the manufacturing process to proceed in a single production line. Therefore, the manufacturing time and cost may be reduced. A profile of the wiring pattern may be determined by the shape of an impression pattern of a mold. This may establish the top width of inner and outer leads and incorporate fine pad pitch. Although ILB and OLB process may use an NCP, connection reliability may be established due to the soft and elastic wiring pattern.

A semiconductor chip, having an active surface including a peripheral area and a central area, presents a connection area formed on a portion of the peripheral area. The semiconductor chip includes output pads formed in the peripheral area of the active surface and input pads formed in the central area of the active surface. The input pads may be connected to wiring patterns of a TAB tape passing over the connection area.

Semiconductor chip and TAB package having the same

Semiconductor package films and a display module comprising a packaged semiconductor device punched from a semiconductor package film are provided. In one embodiment, the invention provides a semiconductor package film comprising a base film comprising a plurality of semiconductor device regions, an intermediate region disposed on a first surface of the base film and disposed between two semiconductor device regions, and a reinforcing member attached to a second surface of the base film opposite the first surface of the base film and attached opposite the intermediate region. Each semiconductor device region comprises a semiconductor mounting region adapted to receive a semiconductor chip, and first and second metal line regions.

Semiconductor package film having reinforcing member and related display module

A semiconductor package includes a semiconductor chip, a circuit board at which a wire pattern is formed, and a metal structure including a portion inserted through an opening of the circuit board and upon which the semiconductor chip rests. With the semiconductor chip in direct contact with the metal structure, thermal characteristics improve. With the circuit board supported by the metal structure, mechanical stability improves.

A tape circuit substrate and semiconductor apparatus employing the same, and a method for forming a tape circuit substrate may reduce or eliminate electromagnetic interference (EMI) and provide a substrate or apparatus which can supply a more stable power supply voltage. The tape circuit substrate may include an insulation film and a wiring pattern formed on the insulation film to define an electronic device-mounting region and including a ground electrode. The tape circuit substrate may include a ground electrode pattern formed at the electronic device-mounting region so as to be insulated from the wiring pattern, except where the ground electrode pattern is connected to the ground electrode.

Tape circuit substrate and semiconductor apparatus employing the same

Semiconductor chip and tab package having the same

Growing community of inventors

Seoul, South Korea

Sa-Yoon Kang