The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2011
Filed:
Oct. 15, 2007
Kyoung-sei Choi, Gyeonggi-do, KR;
Sa-yoon Kang, Seoul, KR;
Yong-hwan Kwon, Gyeonggi-do, KR;
Chung-sun Lee, Gyeonggi-do, KR;
Kyoung-Sei Choi, Gyeonggi-do, KR;
Sa-Yoon Kang, Seoul, KR;
Yong-Hwan Kwon, Gyeonggi-do, KR;
Chung-Sun Lee, Gyeonggi-do, KR;
Samsung Electronics Co., Ltd., Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;
Abstract
A method for manufacturing a tape wiring board in accordance with the present invention may employ an imprinting process in forming a wiring pattern thereby reducing the number of processes for manufacturing a tape wiring board and allowing the manufacturing process to proceed in a single production line. Therefore, the manufacturing time and cost may be reduced. A profile of the wiring pattern may be determined by the shape of an impression pattern of a mold. This may establish the top width of inner and outer leads and incorporate fine pad pitch. Although ILB and OLB process may use an NCP, connection reliability may be established due to the soft and elastic wiring pattern.