Chung-Sun Lee is a prominent inventor based in Gyeonggi-do, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 14 patents. His work focuses on improving the efficiency and functionality of semiconductor devices.

Latest Patents

Chung-Sun Lee's latest patents include innovations related to semiconductor chip stacks with improved encapsulation. One of his notable inventions is a stack of semiconductor chips that comprises a first chip, a second chip positioned over the first, conductive bumps, a homogeneous integral underfill material, and a molding material. The conductive bumps extend between the upper surface of the first chip and the lower surface of the second chip. The underfill material encapsulates the conductive bumps and extends along the sidewalls of the second chip. This design ensures that the molding material does not contact the sidewalls of the second chip, enhancing the overall performance and reliability of the semiconductor device.

Career Highlights

Chung-Sun Lee has worked with leading companies in the technology sector, including Samsung Electronics Co., Ltd. His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor technology.

Collaborations

Chung-Sun Lee has collaborated with notable professionals in his field, including Yong-Hwan Kwon and Sa-Yoon Kang. These collaborations have contributed to the advancement of his research and the successful development of his patents.

Conclusion

Chung-Sun Lee's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His innovative designs continue to shape the future of semiconductor devices.

This text is generated by artificial intelligence and may not be accurate.

Please report any incorrect information to support@idiyas.com