The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2012
Filed:
Nov. 20, 2008
Woon-seong Kwon, Seoul, KR;
Tae-je Cho, Gyeonggi-do, KR;
Yong-hwan Kwon, Gyeonggi-do, KR;
Un-byoung Kang, Gyeonggi-do, KR;
Chung-sun Lee, Gyeonggi-do, KR;
Hyung-sun Jang, Gyeonggi-do, KR;
Woon-Seong Kwon, Seoul, KR;
Tae-Je Cho, Gyeonggi-do, KR;
Yong-Hwan Kwon, Gyeonggi-do, KR;
Un-Byoung Kang, Gyeonggi-do, KR;
Chung-Sun Lee, Gyeonggi-do, KR;
Hyung-Sun Jang, Gyeonggi-do, KR;
Samsung Electronics Co., Ltd., Maetan-dong, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;
Abstract
Provided are camera modules capable of effectively shielding electromagnetic (EM) waves and methods of fabricating the same. A method of fabricating a camera module includes, preparing a first wafer including an array of lens units. Then, a second wafer including an array of image sensor CSPs (chip-scale packages) is prepared. Each of the image sensor CSPs includes an image sensor chip corresponding to one of the lens units. The first wafer is stacked on the second wafer. The first wafer and the second wafer are cut to form a trench exposing the top surface of the image sensor chip at the interface between adjacent lens units. The trench is filled with a first material used for forming a housing. The first material and the image sensor chip are cut at the interface between the adjacent lens units.