The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 2011
Filed:
Jan. 29, 2009
Hyuek-jae Lee, Suwon-si, Gyeonggi-do, KR;
Tae-je Cho, Yongin-si, Gyeonggi-do, KR;
Yong-hwan Kwon, Suwon-si, Gyeonggi-do, KR;
Un-byoung Kang, Hwaseong-si, Gyeonggi-do, KR;
Chung-sun Lee, Gunpo-si, Gyeonggi-do, KR;
Woon-seong Kwon, Seoul, KR;
Hyung-sun Jang, Suwon-si, Gyeonggi-do, KR;
Hyuek-Jae Lee, Suwon-si, Gyeonggi-do, KR;
Tae-Je Cho, Yongin-si, Gyeonggi-do, KR;
Yong-Hwan Kwon, Suwon-si, Gyeonggi-do, KR;
Un-Byoung Kang, Hwaseong-si, Gyeonggi-do, KR;
Chung-Sun Lee, Gunpo-si, Gyeonggi-do, KR;
Woon-Seong Kwon, Seoul, KR;
Hyung-Sun Jang, Suwon-si, Gyeonggi-do, KR;
Other;
Abstract
One embodiment exemplarily described herein can be characterized as an image sensor including a substrate having a front surface and a rear surface; a photoelectric converting portion on the front surface of the substrate; a through via extending through the substrate, wherein the through via is electrically connected to the photoelectric converting portion; an external connection terminal on the rear surface of the substrate, wherein the external connection terminal is connected to the through via; and a light shading layer formed on a portion of the rear surface of the substrate, wherein the light shading layer is substantially opaque with respect to an external light. In some embodiments, the portion of the rear surface of the substrate on which the light shading layer is formed is not overlapped by the through via or the external connection terminal.