The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2008
Filed:
Jun. 30, 2005
Suk-chae Kang, Gyeonggi-do, KR;
Si-hoon Lee, Gyeonggi-do, KR;
Sa-yoon Kang, Seoul, KR;
Dong-han Kim, Gyeonggi-do, KR;
Yun-hyeok Im, Gyeonggi-do, KR;
Gu-sung Kim, Gyeonggi-do, KR;
Suk-Chae Kang, Gyeonggi-do, KR;
Si-Hoon Lee, Gyeonggi-do, KR;
Sa-Yoon Kang, Seoul, KR;
Dong-Han Kim, Gyeonggi-do, KR;
Yun-Hyeok Im, Gyeonggi-do, KR;
Gu-Sung Kim, Gyeonggi-do, KR;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
A semiconductor package includes a semiconductor chip, a circuit board at which a wire pattern is formed, and a metal structure including a portion inserted through an opening of the circuit board and upon which the semiconductor chip rests. With the semiconductor chip in direct contact with the metal structure, thermal characteristics improve. With the circuit board supported by the metal structure, mechanical stability improves.