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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7915727 B1

PDFFull Text
Date of Patent:
Mar. 29, 2011

Filed:

Apr. 17, 2009

Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same

Applicants:

Kyoung-sei Choi, Yongin-si, KR;

Byung-seo Kim, Suwon-si, KR;

Young-jae Joo, Yongin-si, KR;

Ye-chung Chung, Hwaseong-si, KR;

Kyong-soon Cho, Goyang-si, KR;

Sang-heui Lee, Cheonan-si, KR;

Si-hoon Lee, Suwon-si, KR;

Sa-yoon Kang, Seoul, KR;

Dae-woo Son, Cheonan-si, KR;

Sang-gui JO, Seoul, KR;

Jeong-kyu Ha, Yongin-si, KR;

Young-sang Cho, Yongin-si, KR;

Inventors:

Kyoung-sei Choi, Yongin-si, KR;

Byung-seo Kim, Suwon-si, KR;

Young-jae Joo, Yongin-si, KR;

Ye-chung Chung, Hwaseong-si, KR;

Kyong-soon Cho, Goyang-si, KR;

Sang-heui Lee, Cheonan-si, KR;

Si-hoon Lee, Suwon-si, KR;

Sa-yoon Kang, Seoul, KR;

Dae-woo Son, Cheonan-si, KR;

Sang-gui Jo, Seoul, KR;

Jeong-kyu Ha, Yongin-si, KR;

Young-sang Cho, Yongin-si, KR;

Assignee:

Samsung Electronics Co., Ltd., Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;

Attorney:

Muir Patent Consulting, PLLC

Primary Examiner:

Roy K Potter

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component.

Find Patent Forward Citations

Choi, Kyoung-sei. (2011). Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same (U.S. Patent No. 7915727). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7915727

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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