Rémi Brechignac

Title: **Rémi Brechignac: Innovator in Electronic Packaging and Systems**

Introduction

Rémi Brechignac is an accomplished inventor based in Grenoble, France, renowned for his contributions to the field of electronics. With a portfolio comprising five patents, Brechignac's inventions focus on innovative electronic packaging and integration methods, enhancing the performance and reliability of electronic systems.

Latest Patents

One of Brechignac's notable patents is the "Perforated Electronic Package and Method of Fabrication." This invention features an electronic package that includes an integrated circuit chip mounted on a support plate and encapsulated by an encapsulating body. The package design incorporates at least one weakening deep perforation, strategically placed in the support plate or the encapsulating body. This innovation serves to reduce the resistance of the package to bending stresses perpendicular to the support plate, improving its durability.

Another significant patent is the "Electronic System Comprising Stacked Electronic Devices Comprising Integrated-Circuit Chips." This electronic system consists of two integrated-circuit chips linked by a unique connection network facilitated through substrate wafers. The design allows for efficient electrical connections and thermal management, showcasing Brechignac's commitment to optimizing electronic device performance.

Career Highlights

Rémi Brechignac has an impressive career in electronics, having worked with companies such as STMicroelectronics in Grenoble. His expertise and innovative thinking have contributed significantly to advancements in electronic packaging and device integration.

Collaborations

Throughout his career, Brechignac has collaborated with talented professionals, including Kevin Channon and Romain Coffy. These partnerships have fostered creativity and led to the successful development of cutting-edge technologies in electronic systems.

Conclusion

In summary, Rémi Brechignac is a key figure in the realm of electronics, whose inventive spirit has led to multiple patents that push the boundaries of electronic packaging and integration. His work continues to influence the future of electronic devices, making them more efficient and resilient.