The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2015
Filed:
Mar. 06, 2015
Applicants:
Stmicroelectronics (Grenoble 2) Sas, Grenoble, FR;
Stmicroelectronics (Rousset) Sas, Rousset, FR;
Inventors:
Francis Steffen, Saint-Maximin, FR;
Delphine Mathey, Grenoble, FR;
Gilbert Assaud, Marseille, FR;
Rémi Brechignac, Grenoble, FR;
Assignees:
STMicroelectronics (Grenoble 2) SAS, Grenoble, FR;
STMicroelectronics (Rousset) SAS, Rousset, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/04 (2006.01); H01L 23/522 (2006.01); H01L 21/311 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/31105 (2013.01); H01L 21/565 (2013.01); H01L 23/04 (2013.01); H01L 23/315 (2013.01); H01L 23/3107 (2013.01); H01L 23/3121 (2013.01); H01L 23/3128 (2013.01); H01L 23/522 (2013.01); H01L 23/57 (2013.01);
Abstract
An electronic package includes an integrated circuit chip mounted to a support plate and encapsulated by an encapsulating body. The package includes at least one weakening deep perforation. The perforation is formed in either the support plate or the encapsulating body, and functions to reduce a resistance of the package to bending stresses perpendicular to the support plate.