Stmicroelectronics (grenoble 2) Sas

Stmicroelectronics S.a.

Stmicroelectronics (rousset) Sas

Stmicroelectronics R&d Limited

Rémi Brechignac

Romain Coffy

Kevin Channon

Eric Saugier

Luc Petit

Juan Exposito

Jean-Luc Diot

Jacques Chavade

Francis Steffen

Gilbert Assaud

Dominique Marais

Eric Chistison

Delphine Mathey

An electronic package includes an integrated circuit chip mounted to a support plate and encapsulated by an encapsulating body. The package includes at least one weakening deep perforation. The perforation is formed in either the support plate or the encapsulating body, and functions to reduce a resistance of the package to bending stresses perpendicular to the support plate.

Perforated electronic package and method of fabrication

An electronic system includes a first integrated-circuit chip and a second integrated-circuit chip. A first substrate wafer is positioned between the first and second integrated-circuit chips and configured with a first connection network to make electrical connection to the first integrated-circuit chip. A second substrate wafer, configured with a second connection network to make electrical connection to the second integrated-circuit chip, is positioned facing the first substrate wafer. The connection networks of the first and second substrate wafers are electrically connected through connection structures. A third substrate wafer, including a third connection network, is thermally in contact with the first integrated-circuit chip and electrically connected to the first connection network of the first substrate wafer through further connection structures. The further connection structure may be formed using another substrate wafer.

Electronic system comprising stacked electronic devices comprising integrated-circuit chips

An electronic package includes a substrate wafer with an interconnect network. A first chip is fixed to a front of the substrate, connected to the interconnect network and encapsulated by a body. A second chip is placed on a back side of the substrate wafer and connected to the interconnect network by back-side connection elements interposed between the back side of the substrate and a front side of the second chip. Front-side connection elements are placed on the front side of the substrate and connected to the interconnect network. The connection elements extend beyond the frontal face of the body. The package may be mounted on a board with an interposed thermally conductive material.

Dual side package on package

A semiconductor packaging unit mounts onto a board by solder joints. The unit includes, disposed along one axis, a semiconductor component having on a rear face protruding electrical connection lugs designed to be soldered onto the board and an external cage surrounding the component and having a rear edge designed to be soldered onto the board and a front part through which a front part of the component passes. The component and the cage are designed to axially slide with respect to one another in such a manner as to be brought into their soldering position with respect to the board and having complementary holding parts coming into contact and designed to hold them with respect to one another when they are axially removed from the soldering position and to free them with respect to one another when they are at the soldering position.

Semiconductor packaging unit with sliding cage

A semiconductor package is mounted to a support plate through a base. The base is inserted between a rear face of the semiconductor package and a front face of the support plate. An electrical connection mechanism is provided to connect the semiconductor package to the support plate pass. This mechanism passes through the base. The mounting of the semiconductor package is accomplished by a variety of structures to fasten the package onto the said support plate. These structures cooperate with and are placed below the rear face of the semiconductor package.

Device for mounting a semiconductor package on a support plate via a base

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Grenoble, France

Rémi Brechignac