The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2006

Filed:

Feb. 05, 2003
Applicants:

Rémi Brechignac, Grenoble, FR;

Kevin Channon, Edinburgh, GB;

Juan Exposito, St Nazaire les Eymes, FR;

Inventors:

Rémi Brechignac, Grenoble, FR;

Kevin Channon, Edinburgh, GB;

Juan Exposito, St Nazaire les Eymes, FR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/32 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor package is mounted to a support plate through a base. The base is inserted between a rear face of the semiconductor package and a front face of the support plate. An electrical connection mechanism is provided to connect the semiconductor package to the support plate pass. This mechanism passes through the base. The mounting of the semiconductor package is accomplished by a variety of structures to fasten the package onto the said support plate. These structures cooperate with and are placed below the rear face of the semiconductor package.


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