Company Filing History:

17 out of 42,485

Hitachi, Ltd.

patents

1 out of 1,037

Agency of Industrial Science and Technology

patents

1 out of 1,641

Hitachi Chemical Company, Ltd.

patents

4. 1 out of 3,868

Nitto-denko Corporation

patents

where one patent can have more than one assignee

Years Active: 1978-2001

where 'Filed Patents' based on already Granted Patents

18 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 6326561 - Thin-film multilayer wiring board with wiring and via holes in a thickness of an insulating layer (2001-12-04),

2. 6190493 - Thin-film multilayer wiring board and production thereof (2001-02-20),

3. 5768108 - Multi-layer wiring structure (1998-06-16),

4. 5565706 - LSI package board (1996-10-15),

5. 5497545 - Method of making electrical connections in the manufacture of wiring (1996-03-12),

6. 5187052 - Optical recording medium (1993-02-16),

7. 5178962 - Metal-organic macromolecular synthetic resin composite and process for (1993-01-12),

8. 5133989 - Process for producing metal-polyimide composite article (1992-07-28),

9. 5120573 - Process for producing metal/polyimide composite article (1992-06-09),

10. 4836978 - Method for making vacuum circuit breaker electrodes (1989-06-06),

11. 4718053 - Optical information apparatus and method of recording and erasing (1988-01-05),

12. 4651172 - Information recording medium (1987-03-17),

13. 4551596 - Surge-absorberless vacuum circuit interrupter (1985-11-05),

14. 4547639 - Vacuum circuit breaker (1985-10-15),

15. 4546222 - Vacuum switch and method of manufacturing the same (1985-10-08),

Title: Ryuji Watanabe: Innovator in Thin-Film Multilayer Wiring Technology

Introduction

Ryuji Watanabe is a prominent inventor based in Ibaraki, Japan, known for his significant contributions to the field of thin-film multilayer wiring technology. With a total of 18 patents to his name, Watanabe has made remarkable advancements that enhance the performance and efficiency of electronic components.

Latest Patents

Watanabe's latest patents include a thin-film multilayer wiring board featuring wiring and via holes within a specific thickness of an insulating layer. This innovative design incorporates first and second metallic wiring layers formed on a substrate, with an organic insulating layer interposed between them. The insulating layer contains via holes, allowing for electrical connections through via studs made of conductive metal. Another notable patent describes a thin-film multilayer wiring board that achieves high wiring density and superior signal transmission performance through precise manufacturing techniques.

Career Highlights

Throughout his career, Ryuji Watanabe has worked with esteemed organizations such as Hitachi, Ltd. and the Agency of Industrial Science and Technology. His work has been instrumental in pushing the boundaries of technology in the electronics sector, particularly in the development of advanced wiring solutions.

Collaborations

Watanabe has collaborated with notable colleagues, including Osamu Miura and Akio Takahashi, contributing to various projects that have furthered the field of thin-film technology.

Conclusion

Ryuji Watanabe's innovative work in thin-film multilayer wiring technology has established him as a key figure in the electronics industry. His patents reflect a commitment to enhancing the performance of electronic components, making significant strides in the field.

This text is generated by artificial intelligence and may not be accurate.

Please report any incorrect information to support@idiyas.com

Inventor’s Patent Attorneys refers to legal professionals with specialized expertise in representing inventors throughout the patent process. These attorneys assist inventors in navigating the complexities of patent law, including filing patent applications, conducting patent searches, and protecting intellectual property rights. They play a crucial role in helping inventors secure patents for their innovative creations.