Hitachi, Ltd.

Nitto-denko Corporation

Hitachi Chemical Company, Ltd.

Agency of Industrial Science and Technology

Ryuji Watanabe

Osamu Miura

Akio Takahashi

Kunio Miyazaki

Yukio Ookoshi

Keiichi Kuniya

Takao Miwa

Toshio Miyamoto

Masahiro Suzuki

Tsutomu Imai

Hisashi Ando

Kiyoji Iwashita

Toshiki Kaneko

Yuichi Satsu

Yukio Kurosawa

Takeyuki Itabashi

Tetsuo Ito

Hitoshi Suzuki

Hisashi Andoh

Yoshihito Maeda

Masaichi Nagai

Sadami Tomita

Seiki Shimizu

Amane Mochizuki

Hiroshi Sasaki

Haruo Akahoshi

Motoyo Wajima

Yoshio Sato

Shigeru Takahashi

Nobuyoshi Tsuboi

Shunichi Numata

Tetsuro Minemura

Junichi Katagiri

Koji Fujisaki

Shigeo Amagi

Yoshiyuki Tsuru

Kazumasa Igarashi

Isao Ikuta

Michio Ohue

Hideo Arakawa

Norifumi Miyamoto

Hideki Nihei

Hiroaki Koyanagi

Atsumi Watanabe

Akira Wada

Takayoshi Ikeda

Hisae Shimanoki

Yoshimi Katou

Hideaki Tsuda

Kiyoshi Konno

Yoichi Daiko

Yukio Okoshi

Mikio Aizawa

Syoichi Sato

Satoshai Shimada

Kinko Shimizu

A thin-film multilayer wiring board with first and second metallic wiring layers formed on a substrate and an organic insulating layer interposed between the metallic wiring layers. The insulating layer has the first metallic wiring layer and via holes in a thickness of the insulating layer. The lands of the first and second metallic wiring layers are electrically connected by via studs which are made of a conductive metal filled in the via holes.

Thin-film multilayer wiring board with wiring and via holes in a thickness of an insulating layer

A thin-film multilayer wiring board comprising a first and a second metallic wiring layers formed on a substrate with an organic insulating layer interposed between the metallic wiring layers, wherein the lands of the first and second metallic wiring layers are electrically connected by via studs made of a conductive metal filler formed by electroless plating, and the difference between the top end diameter and the base diameter of each via stud is 10% or less, or the angle made by the taper of the interface between the insulating layer and each via stud against the axis thereof is 5&deg; or less, can provide a high wiring density and signal transmission performance.

Thin-film multilayer wiring board and production thereof

A multi-layer wiring structure for mounting electronic devices is provided to be used in an electronic computer, a work station or the like, and more particularly a multi-layer packaging board having microscopic wiring layers, which board has an excellent dimensional stability and a high reliability, and also a method of producing such a board are provided. The multi-layer wiring structure includes a complex of at least two sub-assemblies each having wiring layers formed respectively on opposite sides of a core material of a low thermal expansive metal through an insulation layer in such a manner that the wiring layers correspond in area ratio to each other. The sub-assemblies are connected to one another by conductors via through holes. In this structure, the wiring structure having the core material of a low thermal expansive metal is used as a base, and therefore a dimensional change of a board is small, and microscopic wiring layers can be formed, and the reliability of connection between the sub-assemblies is enhanced. Furthermore, the board can be produced at low costs.

Multi-layer wiring structure

A thin and high-density package board used with general-purpose mainframe computers and high-speed processors is provided. On a ceramic substrate on which memory LSIs and a logic LSI with only elements formed without multilayer wiring are mounted, a multilayer wiring layer insuring signal transfer of the LSIs is formed, providing a thin package board.

LSI package board

A multi-layer wiring assembly including a stack of insulating layers, e.g. of polyimide, alternating with wiring patterns, typically of copper. To establish the circuit pattern, successive wiring patterns are connected to one another through the intervening insulating layers at predetermined locations, by metal stud connections. The studs are formed during assembly of the stack by wire-bonding a stud onto an underlying wiring pattern through a through-hole of the insulating layer above, and then stamping the exposed end of the wire-bonded stud to spread it into contact with the uppermost wiring pattern. The wire-bonded studs e.g. of Au, form strong bonds with the underlying conductor and are quick to apply in an automated process using a wire-bonding machine.

Method of making electrical connections in the manufacture of wiring

An optical recording medium, which comprises a recording layer capable of reversibly undergoing a phase change between a crystalline state and an amorphous state by irradiation of an electromagnetic energy, the crystalline state of the recording layer being composed of a single phase of substantially a three-component compound or a higher multi-component compound can attain high speed recording and high speed erasing that cannot be obtained with the conventional optical recording medium.

Optical recording medium

A composite of metal and an organic film having a high adhesiveness without deterioration of film quality is provided by exposing the surface of organic film to at least one of chemically reactive gas phase molecules and gas phase ions thereby forming functional groups on the surface of organic film, and forming a metallic film thereon through the functional groups.

Metal-organic macromolecular synthetic resin composite and process for

The present invention provides a process for producing a metal-polyimide composite material such as a wiring board. In production thereof, deterioration of polyamide film due to oxidation during imidization of a polyimide precursor in contact with metal such as copper or silver can be prevented. The present invention is characterized by using a polyimide precursor having an acidic functional group which is masked. Examples of the polyamide precursor are polyamic acid epoxy adducts, amido polyamic acids, silylated polyamic acids, etc.

Process for producing metal-polyimide composite article

The present invention provides a process for producing a metal/polyimide composite article such as high-density wiring boards. This metal/polyimide composite article is produced by a method which comprises coating a polyamic acid alkyl ester represented by the following formula on a metallic film and curing it: ##STR1## wherein R.sub.1 and R.sub.2 which may be identical or different each represents an organic group of 1 or more carbon atoms.

Process for producing metal/polyimide composite article

A production method of a vacuum circuit breaker electrode comprises the steps of mixing conductive metal powder, and refractory material powder with a higher melting point than said conductive metal powder, compacting the resultant mixture to form a compact, presintering the compact in a atmosphere of high purity hydrogen, sealing a presintered body in a capsule while exhausting, heating and degassing, and subjecting the sealed capsule to hot isostatic pressing treatment. The conductive metal powder is one or both of Cu and Ag. The hot isostatic pressing treatment is effected at a temperature higher than a melting point of the conductive metal so that the presintered body is sintered under liquid phase, and a part of molten conductive metal component is seeped out on a sintered body surface.

Method for making vacuum circuit breaker electrodes

The present invention employs as a recording medium a metal or alloy which exhibits an intercrystalline transition before and after writing. In the present invention, two light beams of unequal wavelengths are used so as to write information with the light beam of the longer wavelength and to erase information with the light beam of the shorter wavelength. In changing a written content, a wavelength with which the reflection rate of the recording medium increases is used.

Optical information apparatus and method of recording and erasing

In an information recording medium having a recording layer for recording information by heating through incoming energy, at least one of an interference layer and an absorption layer for the incoming energy is provided on the energy-incoming side of the recording layer to reduce the reflected energy from the information recording medium and increase the quantity of heat input into the recording layer. The temperature of the recording layer is rapidly enhanced, and rapid writing is made possible thereby. Writing or erasing can be made with less incoming energy, and thus the writing sensitivity or erasing sensitivity of the information recording medium can be increased.

Information recording medium

A small-sized, light weighted vacuum circuit interrupter is provided. The interrupter comprises a vacuum container confining a vacuum atmosphere of a pressure less than 10.sup.-5 mmHg and a pair of electrodes at least one of which is a movable electrode for making and breaking an electric circuit including either a transformer of a rated surge voltage strength of less than 45 kV or a motor of a rated surge voltage strength of less than 25 kV. At least one of the electrodes has a contact made of a porous body of a refractory conductive material and an impregnate selected from the group consisting of silver telluride, silver selenide and mixtures thereof impregnated in the porous body in an amount sufficient to give the interrupter a chopping current of not more than 1A and an arc extinguishing capability at 1MHz of not more than 27 A/.mu.s when measured in a circuit of 6 kV. The interrupter can be connected to the load without a surge absorber for protecting the breaker from a surge voltage generated at the time of interrupting the circuit.

Surge-absorberless vacuum circuit interrupter

A vacuum circuit breaker comprising a vacuum vessel and a pair of electrodes disposed in the vessel, which is superior in chopping current characteristic, at least a contact of at least one of the electrodes being made of a member having a skeleton of an iron group element, pores in which skeleton are impregnated with at least one kind selected from a group consisting of silver; an alloy of Ag and at least one of Te, Se, Bi, Pb, Tl, In, Cd, Sn and Sb; and the intermetallic compound of Ag, the breaker having rated voltage of 3.6 to 36 KV and rated breaking currents of 8 to 60 KA.

Vacuum circuit breaker

Disclosed is a vacuum switch having a container and a pair of contact electrodes, and a method of manufacturing the same, in which at least one of the contact electrodes is constituted by a member made up of a skeleton containing cobalt as its principal component with pores into which a copper alloy containing copper as its principal component, silver, and a low melting point and high vapor pressure element having substantially no or very low solid-solubility with respect to the copper at a room temperature is impregnated.

Vacuum switch and method of manufacturing the same

Growing community of inventors

Ibaraki, Japan

Ryuji Watanabe