The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 1996
Filed:
Mar. 20, 1995
Osamu Miura, Ibaraki-ken, JP;
Akio Takahashi, Hitachiota, JP;
Takao Miwa, Hitachinaka, JP;
Masahiro Suzuki, Iwaki, JP;
Ryuji Watanabe, Ibaraki-ken, JP;
Junichi Katagiri, Ibaraki-ken, JP;
Yoichi Daiko, Zama, JP;
Tsutomu Imai, Hadano, JP;
Haruo Akahoshi, Hitachi, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A thin and high-density package board used with general-purpose mainframe computers and high-speed processors is provided. On a ceramic substrate on which memory LSIs and a logic LSI with only elements formed without multilayer wiring are mounted, a multilayer wiring layer insuring signal transfer of the LSIs is formed, providing a thin package board.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile