The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2001
Filed:
Nov. 20, 1997
Ryuji Watanabe, Ibaraki-ken, JP;
Takeyuki Itabashi, Hitachi, JP;
Osamu Miura, Ibaraki-ken, JP;
Akio Takahashi, Hitachiota, JP;
Yukio Ookoshi, Mito, JP;
Hitoshi Suzuki, Hitachi, JP;
Masahiro Suzuki, Iwaki, JP;
Tsutomu Imai, Hadano, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A thin-film multilayer wiring board comprising a first and a second metallic wiring layers formed on a substrate with an organic insulating layer interposed between the metallic wiring layers, wherein the lands of the first and second metallic wiring layers are electrically connected by via studs made of a conductive metal filler formed by electroless plating, and the difference between the top end diameter and the base diameter of each via stud is 10% or less, or the angle made by the taper of the interface between the insulating layer and each via stud against the axis thereof is 5° or less, can provide a high wiring density and signal transmission performance.