The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 1992

Filed:

Sep. 27, 1989
Applicant:
Inventors:

Kunio Miyazaki, Hitachi, JP;

Osamu Miura, Hitachi, JP;

Ryuji Watanabe, Ibaraki, JP;

Yukio Ookoshi, Mito, JP;

Toshio Miyamoto, Takasaki, JP;

Mikio Aizawa, Fukaya, JP;

Kazumasa Igarashi, Suzuka, JP;

Amane Mochizuki, Fukaya, JP;

Assignees:

Hitachi, Ltd., Osaka, JP;

Nitto Denko Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C / ;
U.S. Cl.
CPC ...
427 96 ; 4274071 ; 427409 ; 427404 ;
Abstract

The present invention provides a process for producing a metal/polyimide composite article such as high-density wiring boards. This metal/polyimide composite article is produced by a method which comprises coating a polyamic acid alkyl ester represented by the following formula on a metallic film and curing it: ##STR1## wherein R.sub.1 and R.sub.2 which may be identical or different each represents an organic group of 1 or more carbon atoms.


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