The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 04, 2001
Filed:
Jul. 03, 1996
Applicant:
Inventors:
Ryuji Watanabe, Ibaraki-ken, JP;
Takeyuki Itabashi, Hitachi, JP;
Osamu Miura, Ibaraki-ken, JP;
Akio Takahashi, Hitachiota, JP;
Yukio Ookoshi, Mito, JP;
Hitoshi Suzuki, Hitachi, JP;
Masahiro Suzuki, Iwaki, JP;
Tsutomu Imai, Hadano, JP;
Assignee:
HItachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 9/09 ;
U.S. Cl.
CPC ...
H01R 9/09 ;
Abstract
A thin-film multilayer wiring board with first and second metallic wiring layers formed on a substrate and an organic insulating layer interposed between the metallic wiring layers. The insulating layer has the first metallic wiring layer and via holes in a thickness of the insulating layer. The lands of the first and second metallic wiring layers are electrically connected by via studs which are made of a conductive metal filled in the via holes.