The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 1992
Filed:
Sep. 27, 1989
Shunichi Numata, Hitachi, JP;
Takao Miwa, Katsuta, JP;
Takayoshi Ikeda, Ibaraki, JP;
Koji Fujisaki, Hitachi, JP;
Hisae Shimanoki, Hitachi, JP;
Kunio Miyazaki, Hitachi, JP;
Osamu Miura, Hitachi, JP;
Ryuji Watanabe, Ibaraki, JP;
Toshio Miyamoto, Takasaki, JP;
Yukio Okoshi, Mito, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
The present invention provides a process for producing a metal-polyimide composite material such as a wiring board. In production thereof, deterioration of polyamide film due to oxidation during imidization of a polyimide precursor in contact with metal such as copper or silver can be prevented. The present invention is characterized by using a polyimide precursor having an acidic functional group which is masked. Examples of the polyamide precursor are polyamic acid epoxy adducts, amido polyamic acids, silylated polyamic acids, etc.