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Hillsboro, OR, United States of America

Ryan Lei

USPTO Granted Patents = 6

Average Co-Inventor Count = 2.9

ph-index = 4

Forward Citations = 230(Granted Patents)

Location History:

Hillsboro, OR (US) (2004 - 2007)
Hillboro, OR (US) (2007)

Company Filing History:

6 out of 54,781

Intel Corporation

Years Active: 2004-2007

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6 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7279369 - Germanium on insulator fabrication via epitaxial germanium bonding (2007-10-09),

2. 7211890 - Integrating thermoelectric elements into wafer for heat extraction (2007-05-01),

3. 7161224 - Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process (2007-01-09),

4. 7148122 - Bonding of substrates (2006-12-12),

5. 6908027 - Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process (2005-06-21),

6. 6833195 - Low temperature germanium transfer (2004-12-21),

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