This inventor holds 6 USPTO granted patents. Top assignee: Intel Corporation. Active years: 2004-2007.
Location History:
- Hillsboro, OR (US) (2004 - 2007)
- Hillboro, OR (US) (2007)
Company Filing History:
Years Active: 2004-2007
Title: Innovations of Ryan Lei
Introduction
Ryan Lei is an accomplished inventor based in Hillsboro, OR (US). He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His work focuses on advanced fabrication techniques that enhance the performance of semiconductor devices.
Latest Patents
One of Ryan's latest patents is titled "Germanium on insulator fabrication via epitaxial germanium bonding." This invention describes a method for forming a germanium-on-insulator (GOI) substrate. In this process, an epitaxial germanium layer is formed on a first substrate, followed by the formation of a first dielectric film on top of this layer. A second substrate is then bonded to the first substrate through the dielectric film, resulting in a bonded wafer pair. After bonding, the first substrate is removed to expose the epitaxial germanium layer, creating the GOI substrate.
Another notable patent is "Integrating thermoelectric elements into wafer for heat extraction." This invention provides a technique for heat extraction in semiconductor devices. It involves fabricating a thermoelectric film onto a bare wafer, which is then bonded to an active wafer containing at least one device. The bonded wafers are subsequently annealed to enhance their performance.
Career Highlights
Ryan Lei is currently employed at Intel Corporation, where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of modern electronic devices.
Collaborations
Ryan has collaborated with notable colleagues, including Mohamad A Shaheen and Peter G Tolchinsky. Their combined expertise contributes to the success of their projects and innovations.
Conclusion
Ryan Lei's contributions to semiconductor technology through his patents and work at Intel Corporation highlight his role as a leading inventor in the field. His innovative approaches to fabrication techniques are paving the way for future advancements in electronics.