The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2007
Filed:
Sep. 30, 2003
Applicants:
Shriram Ramanathan, Hillsboro, OR (US);
Gregory M. Chrysler, Chandler, AZ (US);
David Chau, Chandler, AZ (US);
Ryan Lei, Hillboro, OR (US);
Inventors:
Shriram Ramanathan, Hillsboro, OR (US);
Gregory M. Chrysler, Chandler, AZ (US);
David Chau, Chandler, AZ (US);
Ryan Lei, Hillboro, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract
An embodiment of the present invention is a technique to provide heat extraction for semiconductor devices. At least a thermoelectric film is fabricated onto a bare wafer. The backside of the bare wafer is bonded to an active wafer having at least a device. The bonded bare and active wafers are annealed.