Company Filing History:
Years Active: 2005-2013
Title: The Innovations of David Chau
Introduction
David Chau is a prominent inventor based in Chandler, AZ (US). He has made significant contributions to the field of semiconductor technology, holding a total of 10 patents. His work focuses on enhancing the efficiency and functionality of semiconductor packages.
Latest Patents
One of David Chau's latest patents is titled "Flexible interconnect pattern on semiconductor package." This invention presents a technique for fabricating a metal interconnect. In this embodiment, a first metal trace is printed on a die that is attached to a substrate or a cavity of a heat spreader within a package. This design allows for the electrical connection of the first metal trace to a power contact in the substrate. A device is then mounted on the first metal trace, enabling it to receive power from the substrate when the package is powered.
Career Highlights
David Chau is currently employed at Intel Corporation, where he continues to innovate and develop new technologies. His work at Intel has positioned him as a key player in the semiconductor industry, contributing to advancements that impact various electronic devices.
Collaborations
Throughout his career, David has collaborated with notable colleagues, including Gregory Martin Chrysler and Yoshihiro Tomita. These partnerships have fostered a creative environment that encourages the exchange of ideas and technological advancements.
Conclusion
David Chau's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His innovative techniques continue to shape the future of electronic devices.