Cold plate and mating manifold plate for ic device cooling system enabling the shipment of cooling system pre-charged with liquid coolant

Abstract

Embodiments of a cold plate and a manifold plate are disclosed. The cold plate may be coupled with an integrated circuit die, and the cold plate may also include a flow path to receive a liquid coolant. Coolant moving through the flow path can remove heat generated by the die. The cold plate may include one or more piercing elements that are coupled with the flow path. The manifold plate may hold a volume of a liquid coolant, and one or more breakable seals on the manifold plate contain the liquid coolant within the manifold plate (and perhaps other components of a fluid cooling system). The piercing element (or elements) on the cold plate may be inserted into the breakable seal (or seals) on the manifold plate to open the breakable seals and establish fluid communication between the cold and manifold plates. The use of a manifold plate including the breakable seals may enable the shipment and storage of a fluid cooling system precharged with a working fluid. Other embodiments are described and claimed.