Intel Corporation

David Chau

Gregory Martin Chrysler

Yoshihiro Tomita

Devendra Natekar

Chuan Hu

Ioan Sauciuc

Paul J Gwin

Ashish Gupta

Shriram Ramanathan

Ryan Lei

An embodiment of the present invention is a technique to fabricate a metal interconnect. A first metal trace is printed on a die attached to a substrate or a cavity of a heat spreader in a package to electrically connect the first metal trace to a power contact in the substrate. A device is mounted on the first metal trace. The device receives power from the substrate when the package is powered.

Flexible interconnect pattern on semiconductor package

An apparatus including a socket having a socket body and a cavity within the socket body. The apparatus further including a thermoelectric cooler coupled to an in-substrate voltage regulator positioned within the cavity. A method including coupling a thermoelectric cooler to an in-substrate voltage regulator positioned within a cavity of a socket and electrically coupling the thermoelectric cooler to the socket using a contact of the socket. A system including an electronic appliance having a processor including an in-substrate voltage regulator positioned within a cavity of a socket coupled to the processor. The system further including a thermoelectric cooler positioned within the cavity and coupled to the in-substrate voltage regulator.

Socket enabled current delivery to a thermoelectric cooler to cool an in-substrate voltage regulator

Embodiments of the invention provide a thin film thermoelectric cooler. The cooler may have a high packing density that provides good cooling performance. The cooler may be formed by forming a first set of cooling elements, depositing a conformal insulating layer on the first set, then forming a second set of cooling elements between the first set of elements.

Densely packed thermoelectric cooler

An apparatus and associated method to provide localized cooling to a microelectronic device are generally described. In this regard, according to one example embodiment, a cooling system comprising one or more thermoelectric cooler(s) is thermally coupled to a heat spreader to provide cooling to one or more hot spot(s) of a microelectronic device.

Localized microelectronic cooling

Embodiments of a cold plate and a manifold plate are disclosed. The cold plate may be coupled with an integrated circuit die, and the cold plate may also include a flow path to receive a liquid coolant. Coolant moving through the flow path can remove heat generated by the die. The cold plate may include one or more piercing elements that are coupled with the flow path. The manifold plate may hold a volume of a liquid coolant, and one or more breakable seals on the manifold plate contain the liquid coolant within the manifold plate (and perhaps other components of a fluid cooling system). The piercing element (or elements) on the cold plate may be inserted into the breakable seal (or seals) on the manifold plate to open the breakable seals and establish fluid communication between the cold and manifold plates. The use of a manifold plate including the breakable seals may enable the shipment and storage of a fluid cooling system precharged with a working fluid. Other embodiments are described and claimed.

Cold plate and mating manifold plate for IC device cooling system enabling the shipment of cooling system pre-charged with liquid coolant

An embodiment of the present invention is a technique to provide heat extraction for semiconductor devices. At least a thermoelectric film is fabricated onto a bare wafer. The backside of the bare wafer is bonded to an active wafer having at least a device. The bonded bare and active wafers are annealed.

Integrating thermoelectric elements into wafer for heat extraction

A heat pipe is provided, which includes at least one outer structural wall, a wicking structure, and an inner retaining wall for the wicking structure. The outer structural wall has condenser, intermediate, and evaporator sections sequentially after one another. The wicking structure includes a plurality of wicking components onto which a fluid condenses at the condenser section when heat transfers therefrom out through the condenser section, flows thereon through the intermediate section, and evaporates therefrom when heat transfers thereto through the evaporator section. The wicking components are held in place between the intermediate section and an outer surface of the inner retaining wall. The fluid evaporating from the evaporator section recirculates past an inner surface of the inner retaining wall to the condenser section.

Growing community of inventors

Chandler, AZ, United States of America

David Chau