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For the Inventor, By the Inventor

Hillsboro, OR, United States of America

Shriram Ramanathan

This inventor holds 35 USPTO granted patents, primarily in Microelectronic Packaging. Top assignee: Intel Corporation. Active years: 2005-2016.

USPTO Granted Patents = 35

% Patents Active = 51.4

Average Co-Inventor Count = 3.2

ph-index = 11

Forward Citations = 1,391(Granted Patents)


Location History:

  • Cambridge, MA (US) (2007 - 2010)
  • Hillsboro, OR (US) (2005 - 2013)
  • Portland, OR (US) (2006 - 2016)

Company Filing History:

goldMedal35 out of 56,240 
 
Intel Corporation
 patents

Years Active: 2005-2016

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Areas of Expertise:
Microelectronic Packaging
Thermoelectric Cooling
3D Stacking
Biomolecule Detection
Metal-Metal Bonding
Wafer Bonding
Integrated Circuits
Die Cooling Systems
Portable NMR Devices
Self-Passivating Interconnects
Thermal Management
Stacked Device Underfill
35 patents (USPTO):Explore Patents
1. 9508675 - Microelectronic package having direct contact heat spreader and method of manufacturing same (2016-11-29),
2. 8541876 - Microelectronic package having direct contact heat spreader and method of manufacturing same (2013-09-24),
3. 8512559 - Device, method, and system for separation and detection of biomolecules and cells (2013-08-20),
4. 8421225 - Three-dimensional stacked substrate arrangements (2013-04-16),
5. 8203208 - Three-dimensional stacked substrate arrangements (2012-06-19),
6. 8030782 - Metal-metal bonding of compliant interconnect (2011-10-04),
7. 7973407 - Three-dimensional stacked substrate arrangements (2011-07-05),
8. 7800371 - Portable NMR device and method for making and using the same (2010-09-21),
9. 7750487 - Metal-metal bonding of compliant interconnect (2010-07-06),
10. 7723759 - Stacked wafer or die packaging with enhanced thermal and device performance (2010-05-25),
11. 7692310 - Forming a hybrid device (2010-04-06),
12. 7663230 - Methods of forming channels on an integrated circuit die and die cooling systems including such channels (2010-02-16),
13. 7589417 - Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same (2009-09-15),
14. 7537954 - Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same (2009-05-26),
15. 7410884 - 3D integrated circuits using thick metal for backside connections and offset bumps (2008-08-12),

Title: The Innovative Journey of Shriram Ramanathan

Introduction: Shriram Ramanathan is a distinguished inventor based in Hillsboro, Oregon. His groundbreaking work in the field of technology has led to numerous patents and innovations that have significantly impacted the industry.

Latest Patents: Shriram Ramanathan holds several recent patents in the areas of nanotechnology, renewable energy, and semiconductor devices. His most recent inventions focus on enhancing the efficiency and sustainability of electronic devices.

Career Highlights: With a background in materials science and engineering, Shriram Ramanathan has had a successful career working in both academia and industry. He has held key research positions at leading technology companies, where he has spearheaded projects that have pushed the boundaries of innovation.

Collaborations: Throughout his career, Shriram Ramanathan has collaborated with top researchers, engineers, and scientists from around the world. His ability to work effectively in multidisciplinary teams has been instrumental in the success of many projects and has led to the development of cutting-edge technologies.

Conclusion: Shriram Ramanathan's passion for innovation and his dedication to advancing technology have established him as a prominent figure in the field of inventors. His contributions continue to inspire the next generation of innovators and shape the future of technology.

Profile summary based on public USPTO records.
Please report any incorrect information to [email protected]
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