Intel Corporation

Shriram Ramanathan

Patrick R Morrow

Grant M Kloster

Sarah E Kim

Chang-Min Park

Mauro J Kobrinsky

Gregory Martin Chrysler

Kevin O'Brien

Kenneth C Cadien

Scott List

Alan M Myers

Rajashree Raji Baskaran

Thomas N Marieb

Michael Y Chan

Michael C Harmes

Chin Chang Cheng

Valery M Dubin

Daoqiang Lu

Chuan Hu

Michael D Goodner

R Scott List

Gilroy J Vandentop

Sriram Muthukumar

Vijayakumar S Ramachandrarao

David Staintes

Paul B Fischer

Eric Jin Li

Steven N Towle

Jun He

Ying Zhou

Anna M George, Legal Representative

David Chau

Ryan Lei

David W Staines

Sarah Eunkyung Kim

Vijayakumar RamachandraRao

Scott (Richard) List

Chin-Chang Chen

A method of fabricating a microelectronic package having a direct contact heat spreader, a package formed according to the method, a die-heat spreader combination formed according to the method, and a system incorporating the package. The method comprises metallizing a backside of a microelectronic die to form a heat spreader body directly contacting and fixed to the backside of the die thus yielding a die-heat spreader combination. The package includes the die-heat spreader combination and a substrate bonded to the die.

Microelectronic package having direct contact heat spreader and method of manufacturing same

Embodiments of the invention relate to device, method, and system for separation and/or detection of biological cells and biomolecules using micro-channels, magnetic interactions, and magnetic tunnel junctions. The micro-channels can be integrated into a microfluidic device that may be part of an integrated circuit. Magnetic interactions used for the separation are created, in part, by magnetic stripes associated with the micro-channels. Detection of biological cells and biomolecules is effectuated by a magnetic tunnel junction sensor that comprises two ferromagnetic layers separated by a thin insulating layer. The magnetic tunnel junction sensor can be integrated into a silicon based device, such a microfluidic device, an integrated circuit, or a microarray to achieve rapid and specific separation and/or detection of biomolecules and cells.

Device, method, and system for separation and detection of biomolecules and cells

Three-dimensional stacked substrate arrangements with reliable bonding and inter-substrate protection.

Three-dimensional stacked substrate arrangements

Embodiments of the invention provide a first component with a compliant interconnect bonded to a second component with a land pad by a metal to metal bond. In some embodiments, the first component may be a microprocessor die and the second component a package substrate.

Metal-metal bonding of compliant interconnect

An embodiment of the invention relates to a portable or handheld device for performing NMR analysis. The device comprises a console and a strip which can be placed into the console through a slot or other means. The strip comprises a sample holding place and a microcoil for generating an excitation magnetic field across a sample in the sample holding space. A permanent magnet is provided either by the console or the strip and generates a static magnetic field which, together with the excitation magnetic field, creates NMR within the sample. Other embodiments of the invention also encompass method of performing NMR analysis using the portable device and method of making such devices.

Portable NMR device and method for making and using the same

An apparatus includes a metallization region including a plurality of metal layers on a device layer of a substrate, a via extending through the substrate and the device layer, and a heat spreading and stress engineering region in the substrate and adjacent to the device layer. The via contacts a metal layer in the metallization region.

Stacked wafer or die packaging with enhanced thermal and device performance

In one embodiment, the present invention includes a hybrid device having a first die including a semiconductor device and a second die coupled to the first die, where the second die includes a magnetic structure. The first die may be a semiconductor substrate, while the second die may be a magnetic substrate, and the first die may be stacked on the second die, in one embodiment. Other embodiments are described and claimed.

Forming a hybrid device

A method of forming channels on a die or other substrate. Also disclosed are liquid cooling systems including such channels.

Methods of forming channels on an integrated circuit die and die cooling systems including such channels

A microelectronic assembly is provided, having thermoelectric elements formed on a die so as to pump heat away from the die when current flows through the thermoelectric elements. In one embodiment, the thermoelectric elements are integrated between conductive interconnection elements on an active side of the die. In another embodiment, the thermoelectric elements are on a backside of the die and electrically connected to a carrier substrate on a front side of the die. In a further embodiment, the thermoelectric elements are formed on a secondary substrate and transferred to the die.

Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same

Backside connections for 3D integrated circuits and methods to fabricate thereof are described. A stack of a first wafer over a second wafer that has a substrate of the first wafer on top of the stack, is formed. The substrate of the first wafer is thinned. A first dielectric layer is deposited on the thinned substrate. First vias extending through the substrate to the first wafer are formed in the first dielectric layer. A conductive layer is deposited in the first vias and on the first dielectric layer to form thick conductive lines. Second dielectric layer is formed on the conductive layer. Second vias extending to the conductive lines are formed in the second dielectric layer. Conductive bumps extending into the second vias and offsetting the first vias are formed on the second dielectric layer.

3D integrated circuits using thick metal for backside connections and offset bumps

Growing community of inventors

Hillsboro, OR, United States of America

Shriram Ramanathan