The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7723759 B1

PDF
Full Text
Expired
Date of Patent:
May. 25, 2010

Filed:

Oct. 24, 2005
Applicants:

Rajashree Baskaran, Chandler, AZ (US);

Shriram Ramanathan, Portland, OR (US);

Patrick R. Morrow, Portland, OR (US);

Inventors:

Rajashree Baskaran, Chandler, AZ (US);

Shriram Ramanathan, Portland, OR (US);

Patrick R. Morrow, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

An apparatus includes a metallization region including a plurality of metal layers on a device layer of a substrate, a via extending through the substrate and the device layer, and a heat spreading and stress engineering region in the substrate and adjacent to the device layer. The via contacts a metal layer in the metallization region.


Find Patent Forward Citations

Baskaran, Rajashree. (2010). Stacked wafer or die packaging with enhanced thermal and device performance (U.S. Patent No. 7723759). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7723759

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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