The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2013
Filed:
Sep. 30, 2005
Daoqiang LU, Chandler, AZ (US);
Chuan HU, Chandler, AZ (US);
Gilroy J. Vandentop, Tempe, AZ (US);
Shriram Ramanathan, Portland, OR (US);
Rajashree Baskaran, Phoenix, AZ (US);
Valery M. Dubin, Portland, AZ (US);
Daoqiang Lu, Chandler, AZ (US);
Chuan Hu, Chandler, AZ (US);
Gilroy J. Vandentop, Tempe, AZ (US);
Shriram Ramanathan, Portland, OR (US);
Rajashree Baskaran, Phoenix, AZ (US);
Valery M. Dubin, Portland, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A method of fabricating a microelectronic package having a direct contact heat spreader, a package formed according to the method, a die-heat spreader combination formed according to the method, and a system incorporating the package. The method comprises metallizing a backside of a microelectronic die to form a heat spreader body directly contacting and fixed to the backside of the die thus yielding a die-heat spreader combination. The package includes the die-heat spreader combination and a substrate bonded to the die.