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For the Inventor, By the Inventor

Tempe, AZ, United States of America

Gilroy J Vandentop

This inventor holds 29 USPTO granted patents, primarily in Microelectronic Packaging. Top assignee: Intel Corporation. Active years: 1996-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Gilroy J Vandentop. Retrieved from https://idiyas.com/inventor/gilroy-j-vandentop

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 29

% Patents Active = 34.5

Average Co-Inventor Count = 3.1

ph-index = 11

Forward Citations = 461(Granted Patents)


Location History:

  • Aloha, OR (US) (1996 - 1999)
  • Mesa, AZ (US) (2005)
  • Tempe, AZ (US) (2003 - 2016)

Company Filing History:

goldMedal29 out of 56,322 
 
Intel Corporation
 patents

Years Active: 1996-2016

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Areas of Expertise:
Microelectronic Package
Heat Spreader
Optical Integration
Electroosmotic Pump
Transistor Performance
Integrated Circuit
Optical Coupling
Waveguide Mechanism
Thermal Management
Chip-to-Chip Interconnect
Cooling Systems
Patterned Engineering
29 patents (USPTO):Explore Patents
1. 9508675 - Microelectronic package having direct contact heat spreader and method of manufacturing same (2016-11-29),
2. 9153547 - Integrated inductor structure and method of fabrication (2015-10-06),
3. 8541876 - Microelectronic package having direct contact heat spreader and method of manufacturing same (2013-09-24),
4. 7826694 - Electrical/optical integration scheme using direct copper bonding (2010-11-02),
5. 7821073 - Patterned backside stress engineering for transistor performance optimization (2010-10-26),
6. 7703991 - Flip-chip mountable optical connector for chip-to-chip optical interconnectability (2010-04-27),
7. 7576432 - Using external radiators with electroosmotic pumps for cooling integrated circuits (2009-08-18),
8. 7569426 - Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package (2009-08-04),
9. 7372120 - Methods and apparatus to optically couple an optoelectronic chip to a waveguide (2008-05-13),
10. 7371630 - Patterned backside stress engineering for transistor performance optimization (2008-05-13),
11. 7359591 - Electrical/optical integration scheme using direct copper bonding (2008-04-15),
12. 7355277 - Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package (2008-04-08),
13. 7330357 - Integrated circuit die/package interconnect (2008-02-12),
14. 7283699 - Optical package (2007-10-16),
15. 7236666 - On-substrate microlens to couple an off-substrate light emitter and/or receiver with an on-substrate optical device (2007-06-26),

Title: The Inventive Legacy of Gilroy J Vandentop

Introduction:

Gilroy J Vandentop, a brilliant inventor based in Tempe, AZ, has left an indelible mark on the world of innovation with his remarkable contributions. Known for his inventive spirit and commitment to pushing the boundaries of what is possible, Vandentop continues to inspire the next generation of inventors.

Latest Patents:

Gilroy J Vandentop has a total of 29 patents to his name, showcasing his range of expertise in various technological fields. His latest patents include a groundbreaking "Microelectronic package having direct contact heat spreader and method of manufacturing same," revolutionizing the way microelectronic packages are fabricated. Additionally, his "Integrated inductor structure and method of fabrication" patent highlights his innovative approach to inductor design.

Career Highlights:

Vandentop is currently associated with Intel Corporation, a renowned technology company at the forefront of innovation. His tenure at Intel Corporation has been marked by numerous pioneering projects and cutting-edge developments in the field of microelectronics.

Collaborations:

Throughout his career, Gilroy J Vandentop has collaborated with esteemed professionals in the industry, including Daoqiang Lu and Henning Braunisch. These collaborations have led to the successful realization of innovative projects and the development of groundbreaking technologies.

Conclusion:

In conclusion, Gilroy J Vandentop's innovative spirit and dedication to pushing technological boundaries have established him as a prominent figure in the world of innovation. His numerous patents, including the recent advancements in microelectronic packaging and inductor design, reflect his profound impact on the industry. Vandentop's collaborations with industry experts further emphasize his commitment to driving forward progress and inspiring future generations of inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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