The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2009
Filed:
Nov. 09, 2005
Sarah E. Kim, Portland, OR (US);
R. Scott List, Beaverton, OR (US);
James G. Maveety, San Jose, CA (US);
Alan M. Myers, Portland, OR (US);
Quat T. VU, Santa Clara, CA (US);
Ravi Prasher, Phoenix, AZ (US);
Ravi Mahajan, Tempe, AZ (US);
Gilroy Vandentop, Tempe, AZ (US);
Sarah E. Kim, Portland, OR (US);
R. Scott List, Beaverton, OR (US);
James G. Maveety, San Jose, CA (US);
Alan M. Myers, Portland, OR (US);
Quat T. Vu, Santa Clara, CA (US);
Ravi Prasher, Phoenix, AZ (US);
Ravi Mahajan, Tempe, AZ (US);
Gilroy Vandentop, Tempe, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
An integrated circuit to be cooled may be abutted in face-to-face abutment with a cooling integrated circuit. The cooling integrated circuit may include electroosmotic pumps to pump cooling fluid through the cooling integrated circuits via microchannels to thereby cool the heat generating integrated circuit. The electroosmotic pumps may be fluidically coupled to external radiators which extend upwardly away from a package including the integrated circuits. In particular, the external radiators may be mounted on tubes which extend the radiators away from the package.