IDiyas

For the Inventor, By the Inventor

Beaverton, OR, United States of America

R Scott List

USPTO Granted Patents = 39

Average Co-Inventor Count = 3.2

ph-index = 17

Forward Citations = 3,967(Granted Patents)


Company Filing History:

goldMedal39 out of 54,664 
 
Intel Corporation
 patents

Years Active: 2003-2010

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39 patents (USPTO):Explore Patents
1. 7842553 - Cooling micro-channels (2010-11-30),
2. 7723208 - Integrated re-combiner for electroosmotic pumps using porous frits (2010-05-25),
3. 7696015 - Method of forming a stack of heat generating integrated circuit chips with intervening cooling integrated circuit chips (2010-04-13),
4. 7667319 - Electroosmotic pump using nanoporous dielectric frit (2010-02-23),
5. 7615462 - Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack (2009-11-10),
6. 7576432 - Using external radiators with electroosmotic pumps for cooling integrated circuits (2009-08-18),
7. 7569426 - Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package (2009-08-04),
8. 7537954 - Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same (2009-05-26),
9. 7355277 - Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package (2008-04-08),
10. 7348217 - Method and structure for interfacing electronic devices (2008-03-25),
11. 7300871 - Method of doping a conductive layer near a via (2007-11-27),
12. 7274106 - Packaged electroosmotic pumps using porous frits for cooling integrated circuits (2007-09-25),
13. 7227257 - Cooling micro-channels (2007-06-05),
14. 7157787 - Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices (2007-01-02),
15. 7148565 - Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack (2006-12-12),

Title: R Scott List: Innovating Microelectronics in Beaverton, OR

Introduction

R Scott List is a prominent inventor based in Beaverton, Oregon, known for his significant contributions to the field of microelectronics. With an impressive portfolio of 39 patents, he has made remarkable strides in developing technologies that enhance the performance and cooling of electronic devices.

Latest Patents

Among his latest innovations, R Scott List has focused on the following patents:

1. **Cooling Micro-Channels**: This patent describes an apparatus designed for cooling active electronic devices using micro-channels or micro-trenches. The technology aims to improve the efficiency of microelectronic components through enhanced thermal management.

2. **Integrated Re-combiner for Electroosmotic Pumps Using Porous Frits**: This innovative system features trenches coated with a catalyst to remove oxygen or hydrogen from fluids used for cooling. The design facilitates electroosmotic pumping, enhancing the effectiveness of heat removal in microelectronic systems.

Career Highlights

R Scott List currently works at Intel Corporation, a leading multinational technology company renowned for its innovations in semiconductor manufacturing. His work at Intel has propelled advancements in microelectronic technologies, reinforcing the company's position at the forefront of the tech industry.

Collaborations

Throughout his career, R Scott List has collaborated with numerous talented individuals, including his esteemed colleagues Sarah E Kim and Alan M Myers. These partnerships have fostered innovative ideas and have significantly contributed to the development of his patented technologies.

Conclusion

R Scott List's innovations demonstrate his dedication to advancing microelectronics and improving cooling technologies. As he continues to work with leading experts in the field, his contributions are expected to pave the way for future breakthroughs in electronic device performance.

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