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For the Inventor, By the Inventor

Highland, NY, United States of America

Robert Charles Dockerty

USPTO Granted Patents = 13

Average Co-Inventor Count = 2.3

ph-index = 10

Forward Citations = 240(Granted Patents)


Location History:

  • Highland, NY (US) (1976 - 1977)
  • Wappingers Falls, NY (US) (1983)
  • Poughkeepsie, NY (US) (1977 - 1984)
  • Austin, TX (US) (1998 - 2002)

Company Filing History:

goldMedal13 out of 164,197 
 
International Business Machines Corporation
 patents

Years Active: 1976-2002

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13 patents (USPTO):Explore Patents
1. 6395991 - Column grid array substrate attachment with heat sink stress relief (2002-05-28),
2. 6053394 - Column grid array substrate attachment with heat sink stress relief (2000-04-25),
3. 5796169 - Structurally reinforced ball grid array semiconductor package and systems (1998-08-18),
4. 4445267 - MOSFET Structure and process to form micrometer long source/drain spacing (1984-05-01),
5. 4430791 - Sub-micrometer channel length field effect transistor process (1984-02-14),
6. 4409722 - Borderless diffusion contact process and structure (1983-10-18),
7. 4062040 - Field effect transistor structure and method for making same (1977-12-06),
8. 4051273 - Field effect transistor structure and method of making same (1977-09-27),
9. 4044452 - Process for making field effect and bipolar transistors on the same (1977-08-30),
10. 4010482 - Non-volatile Schottky barrier diode memory cell (1977-03-01),
11. T953005 - Schottky barrier diode having chargeable floating gate (1976-12-06),
12. 3992701 - Non-volatile memory cell and array using substrate current (1976-11-16),
13. 3962052 - Process for forming apertures in silicon bodies (1976-06-08),

Title: Innovations of Robert Charles Dockerty

Introduction

Robert Charles Dockerty is a notable inventor based in Highland, NY (US). He has made significant contributions to the field of technology, particularly in the area of printed circuit board design. With a total of 13 patents to his name, Dockerty's work has had a substantial impact on the industry.

Latest Patents

One of Dockerty's latest patents is titled "Column grid array substrate attachment with heat sink stress relief." This invention focuses on a structure and method for reinforcing a solder column grid array attachment of a ceramic substrate to a printed circuit board. The reinforcement provides support for a heat sink that is bonded or affixed by pressure to a structural element of the substrate. The invention involves the concurrent formation of larger solder columns along the perimeter of the substrate, in conjunction with an array of thin electrically interconnecting solder columns. The reinforcing and electrical signal columns are aligned and attached by solder reflow to a corresponding pattern of pads on the printed circuit board. The heat sink is thermally connected to a structural element of the substrate by bonding or mechanical compression. This innovative approach significantly decreases stresses in the solder columns caused by heat sink compressive forces or vibration-induced flexing, all without adding complex manufacturing operations.

Career Highlights

Dockerty has spent a significant portion of his career at the International Business Machines Corporation (IBM). His work at IBM has allowed him to develop and refine his inventions, contributing to the company's reputation as a leader in technology and innovation.

Collaborations

Throughout his career, Dockerty has collaborated with talented individuals such as Shakir A Abbas and Ronald Maurice Fraga. These collaborations have further enhanced the quality and impact of his inventions.

Conclusion

Robert Charles Dockerty is a distinguished inventor whose work has advanced the field of printed circuit board technology. His innovative patents and collaborations reflect his commitment to excellence and innovation in engineering.

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