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For the Inventor, By the Inventor

Hockessin, DE, United States of America

Richard M Levering, Jr

This inventor holds 8 USPTO granted patents. Top assignee: Rodel Holdings, Inc.. Active years: 2000-2002.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Richard M Levering, Jr. Retrieved from https://idiyas.com/inventor/richard-m-levering-jr

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 8

% Patents Active = 100.0

Average Co-Inventor Count = 6.3

ph-index = 6

Forward Citations = 160(Granted Patents)


Company Filing History:

goldMedal8 out of 93 
 
Rodel Holdings, Inc.
 patents

Years Active: 2000-2002

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8 patents (USPTO):Explore Patents
1. 6488570 - Method relating to a polishing system having a multi-phase polishing layer (2002-12-03),
2. 6375559 - Polishing system having a multi-phase polishing substrate and methods relating thereto (2002-04-23),
3. 6337281 - Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like (2002-01-08),
4. 6284114 - Method of fabricating a porous polymeric material by electrophoretic deposition (2001-09-04),
5. 6245679 - Apparatus and methods for chemical-mechanical polishing of semiconductor wafers (2001-06-12),
6. 6210525 - Apparatus and methods for chemical-mechanical polishing of semiconductor wafers (2001-04-03),
7. 6099394 - Polishing system having a multi-phase polishing substrate and methods (2000-08-08),
8. 6069080 - Fixed abrasive polishing system for the manufacture of semiconductor (2000-05-30),

Title: Richard M Levering, Jr: Innovator in Semiconductor Polishing Technologies

Introduction

Richard M Levering, Jr, a prominent inventor based in Hockessin, DE, has made significant contributions to the field of semiconductor polishing. With a total of eight patents to his name, Levering specializes in methods and systems that optimize the polishing process essential for semiconductor manufacturing.

Latest Patents

Among his latest innovations, Levering has developed a method relating to a polishing system featuring a multi-phase polishing layer. This method not only enhances the polishing pad composition by integrating a high modulus phase component and a low modulus phase component but also improves the performance of polishing a semiconductor substrate. His innovative approach creates nanoasperities at the polishing interface, which further enhances the effectiveness of the polishing process. Another noteworthy patent describes a chemical-mechanical polishing system tailored for semiconductor devices, highlighting the versatility and efficiency of multi-phase polishing pads across the entire polishing surface interface.

Career Highlights

Levering's professional journey is marked by his crucial role at Rodel Holdings, Inc., where he continues to push the boundaries of polishing technology. His work has been instrumental in advancing the methodologies that enable the efficient manufacturing of semiconductor components.

Collaborations

Throughout his career, Richard has collaborated with several talented individuals, including David B James and Nina G Chechik. These partnerships have contributed to a dynamic exchange of ideas, reinforcing the innovation culture within his working environment.

Conclusion

Richard M Levering, Jr's contributions to semiconductor polishing technology underscore his status as a leading inventor in the field. His innovative patents reflect a deep understanding of the complexities involved in manufacturing processes and solidify his legacy in the world of high-tech innovations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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