The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2002

Filed:

Sep. 20, 2000
Applicant:
Inventors:

David B. James, Newark, DE (US);

William D. Budinger, Key West, FL (US);

John V. H. Roberts, Newark, DE (US);

Michael R. Oliver, Portland, OR (US);

Nina G. Chechik, Hockessin, DE (US);

Richard M. Levering, Jr., Hockessin, DE (US);

Lee Melbourne Cook, Steelville, PA (US);

Assignee:

Rodel Holdings Inc., Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 1/00 ; B24D 3/28 ;
U.S. Cl.
CPC ...
B24B 1/00 ; B24D 3/28 ;
Abstract

A method of making a polishing pad composition comprising a high modulus phase component and a low modulus phase component, and a method of polishing a semiconductor substrate by creating nanoasperities at a polishing interface between the polishing layer and the wafer during polishing by providing the high modulus phase component at the polishing interface, either as protrusions from the polishing layer, or by being released from the polishing layer into the polishing interface.


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