Portland, OR, United States of America

Michael R Oliver

This inventor holds 17 USPTO granted patents and 1 published patent application, primarily in Chemical Mechanical Polishing. Top assignees: Rodel Holdings, Inc., Intel Corporation, Novaplanar Technology, Inc.. Active years: 1993-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Michael R Oliver. Retrieved from https://idiyas.com/inventor/michael-r-oliver-ozsaggef

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 17 

% Patents Active = 82.4

Average Co-Inventor Count = 2.4

ph-index = 10

Forward Citations = 425(Granted Patents)


Location History:

  • Christiana, DE (US) (1999)
  • Tigard, OR (US) (1993 - 2001)
  • Portland, OR (US) (2000 - 2012)

Company Filing History:


Years Active: 1993-2012

Loading Chart...
Areas of Expertise:
Chemical Mechanical Polishing
Polishing Pads
Semiconductor Wafers
Multi-Phase Polishing
Substrate Carrier Pad
Fixed Abrasive System
Silicon Dioxide
Silicon Nitride
Orbital Motion
Slurry Injection
Composite Polishing
Polishing Composition
17 patents (USPTO):Explore Patents

Title: **Michael R. Oliver: A Pioneer in Semiconductor Polishing Technologies**

Introduction

Michael R. Oliver, based in Portland, OR, is a significant figure in the field of semiconductor manufacturing, holding an impressive portfolio of 17 patents. His work primarily focuses on innovations in polishing pads and techniques used in chemical mechanical planarization—a critical process in semiconductor wafer fabrication.

Latest Patents

Among his latest innovations are two noteworthy patents. The first, "Polishing pads for chemical mechanical planarization and/or other polishing methods," presents a design that enhances post-polish planarity on wafer substrates. This patent introduces exemplary pads containing a bulk matrix with embedded polymer particles, catering to applications involving both composite and single-material substrates. The second patent focuses on "Methods for chemical-mechanical polishing of semiconductor wafers," which describes an innovative approach to polishing semiconductor surfaces using pads equipped with abrasive particles in conjunction with a reactive liquid solution that is essentially free of abrasives. This method alters the ionic strength of the solution to improve the polishing process.

Career Highlights

Michael R. Oliver's career includes significant contributions to leading technology companies. He has worked at renowned firms such as Rodel Holdings, Inc. and Intel Corporation, where he played a crucial role in advancing polishing technologies used in semiconductor manufacturing. His extensive experience in these organizations showcases his expertise and commitment to developing innovative solutions in this competitive industry.

Collaborations

Throughout his career, Michael has collaborated with notable professionals, including David B. James and William D. Budinger. These partnerships have not only enriched his work but have also driven advancements within the industry by bringing together diverse expertise and viewpoints.

Conclusion

Michael R. Oliver stands out as a pioneering inventor in the field of semiconductor polishing. With a substantial number of patents and a rich history of collaboration, his contributions continue to influence the development of more efficient and effective polishing methods in semiconductor manufacturing. His work not only enhances the precision of wafers but also supports the ongoing evolution of technology in the semiconductor sector.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…