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Moraga, CA, United States of America

Richard J Ross

This inventor holds 11 USPTO granted patents. Top assignees: Rjr Polymers, Inc., Stmicroelectronics Gmbh. Active years: 1991-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Richard J Ross. Retrieved from https://idiyas.com/inventor/richard-j-ross-eh2uacv5

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 11

% Patents Active = 100.0

Average Co-Inventor Count = 2.3

ph-index = 6

Forward Citations = 144(Granted Patents)

Company Filing History:

Rjr Polymers, Inc.

Stmicroelectronics Gmbh

where one patent can have more than one assignee

Years Active: 1991-2014

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11 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8759965 - Modular low stress package technology (2014-06-24),

2. 8639373 - Modular low stress package technology (2014-01-28),

3. 8560104 - Modular low stress package technology (2013-10-15),

4. 8283769 - Modular low stress package technology (2012-10-09),

5. 8153474 - Modular low stress package technology (2012-04-10),

6. 6511866 - Use of diverse materials in air-cavity packaging of electronic devices (2003-01-28),

7. 6214152 - Lead frame moisture barrier for molded plastic electronic packages (2001-04-10),

8. 5816158 - Inverted stamping process (1998-10-06),

9. 5706579 - Method of assembling integrated circuit package (1998-01-13),

10. 5572070 - Integrated circuit packages with heat dissipation for high current load (1996-11-05),

11. 5056296 - Iso-thermal seal process for electronic devices (1991-10-15),

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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