The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2014
Filed:
Oct. 13, 2010
Craig J. Rotay, Audubon, PA (US);
John NI, San Leandro, CA (US);
David Lam, San Carlos, CA (US);
David Lee Dewire, Superior, CO (US);
John W. Roman, Natick, MA (US);
Richard J. Ross, Moraga, CA (US);
Craig J. Rotay, Audubon, PA (US);
John Ni, San Leandro, CA (US);
David Lam, San Carlos, CA (US);
David Lee DeWire, Superior, CO (US);
John W. Roman, Natick, MA (US);
Richard J. Ross, Moraga, CA (US);
STMicroelectronics, Inc., Coppell, TX (US);
RJR Polymers, Inc., Oakland, CA (US);
Abstract
A method of designing a desired modular package assembly: determining the configuration and dimensions of the assembly from received user input design data, the assembly having a protective modular package cover with first and second fastening sections, subassembly receiving sections disposed between the fastening sections and having a cross member formed along the underside of the protective modular package cover and configured to receive a subassembly, and one or more subassemblies to be received by the subassembly receiving sections; determining an adhesive deposition strategy for deposition of an adhesive layer to the cross members of the subassembly receiving sections sufficient to affix the top side of the subassemblies to the cross members on the underside of the subassembly receiving sections; and incorporating the configuration and dimensions of the modular package assembly and the adhesive deposition strategy into a manufacturing assembly process configured to manufacture the modular package assembly.