This inventor holds 5 USPTO granted patents. Top assignees: Stmicroelectronics Gmbh, Rjr Polymers, Inc.. Active years: 2012-2014.
Company Filing History:
5 out of 2,891 
3 out of 9 Years Active: 2012-2014
Title: Innovations of David Lam in Modular Package Technology
Introduction
David Lam is an accomplished inventor based in San Carlos, CA (US). He holds a total of 5 patents that showcase his expertise in modular package technology. His innovative designs have significantly contributed to advancements in the field of semiconductor packaging.
Latest Patents
One of David Lam's latest patents is focused on modular low stress package technology. This invention involves a protective modular package assembly that includes one or more subassemblies. Each subassembly consists of a base element, a sidewall element, and a semiconductor device that is coupled to both the base and sidewall elements. The design also features a protective modular package cover with fastening sections at opposing ends, torque elements for fastening, and subassembly receiving sections that accommodate the subassemblies. The torque elements are specifically designed to transfer a downward clamping force to ensure the stability of the subassemblies.
Another patent by Lam outlines a method for designing a modular package assembly. This method includes determining the configuration and dimensions based on user input design data. It also involves creating an adhesive deposition strategy to affix the subassemblies securely within the assembly. The integration of these strategies into the manufacturing process highlights Lam's innovative approach to modular packaging.
Career Highlights
David Lam has worked with notable companies such as STMicroelectronics GmbH and RJR Polymers, Inc. His experience in these organizations has allowed him to refine his skills and contribute to significant advancements in packaging technology.
Collaborations
Throughout his career, David has collaborated with talented individuals, including John Qiang Ni and John W. Roman. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.
Conclusion
David Lam's contributions to modular package technology reflect his dedication to innovation and excellence. His patents and career achievements underscore his role as a leading inventor in the semiconductor industry.