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Forward Citations = 138

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11 inventors (with patents filed for the assignee):

Richard J Ross (9 out of 11 patents)

John Qiang Ni (4 out of 6 patents)

David DeWire (3 out of 6 patents)

4. Craig J Rotay (3 out of 11 patents)

5. David Lam (3 out of 5 patents)

6. John W Roman (3 out of 7 patents)

7. Tony B Shaffer (2 out of 2 patents)

8. K Scott Mellen (1 out of 1 patent)

9. Raymond S Bregante (1 out of 1 patent)

10. Cynthia L Ross (1 out of 1 patent)

11. Jerry E Campbell (1 out of 1 patent)

9 patents: Sort by Forward Citations

1. 8759965 - Modular low stress package technology (2014-06-24),

2. 8639373 - Modular low stress package technology (2014-01-28),

3. 8560104 - Modular low stress package technology (2013-10-15),

4. 6511866 - Use of diverse materials in air-cavity packaging of electronic devices (2003-01-28),

5. 6214152 - Lead frame moisture barrier for molded plastic electronic packages (2001-04-10),

6. 5816158 - Inverted stamping process (1998-10-06),

7. 5706579 - Method of assembling integrated circuit package (1998-01-13),

8. 5572070 - Integrated circuit packages with heat dissipation for high current load (1996-11-05),

9. 5056296 - Iso-thermal seal process for electronic devices (1991-10-15),

RJR Polymers, Inc. is a leading manufacturer of high-quality polymer products for various industries. With over 20 years of experience, we specialize in custom polymer solutions tailored to the specific needs of our clients. Our state-of-the-art facilities and advanced technology ensure top-notch quality and efficiency in our production processes. We are committed to delivering superior products and exceptional customer service.

This text is generated by artificial intelligence and may not be accurate.