The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2013
Filed:
Oct. 13, 2010
Craig J. Rotay, Audubon, PA (US);
John NI, San Leandro, CA (US);
David Lam, San Carlos, CA (US);
David Lee Dewire, Superior, CO (US);
John W. Roman, Natick, MA (US);
Richard J. Ross, Moraga, CA (US);
Craig J. Rotay, Audubon, PA (US);
John Ni, San Leandro, CA (US);
David Lam, San Carlos, CA (US);
David Lee DeWire, Superior, CO (US);
John W. Roman, Natick, MA (US);
Richard J. Ross, Moraga, CA (US);
STMicroelectronics, Inc., Coppell, TX (US);
RJR Polymers, Inc., Oakland, CA (US);
Abstract
A method of designing a modular package: determining a package outline of a modular package assembly from package outline design data; determining seating plane and overall package length characteristics of the assembly from seating plane and package length design data; the design tool calculating minimum package height of the modular package assembly from the seating plane and package length design data; designing the dimensions and configuration of one or more subassemblies from subassembly design data; defining dimensions and configuration of a plurality of mechanical layers of a protective modular package cover given the defined package outline, the seating plane, overall package length, the minimum package height, and the subassemblies; defining an adhesive deposition strategy to join mechanical layers of the cover; designing the cover in accordance with the dimensions and configuration of the mechanical layers; and incorporating the assembly and the adhesive deposition strategy into a manufacturing assembly process.