Rancho Santa Margarita, CA, United States of America

Reza-ur Rahman Khan

USPTO Granted Patents = 40 


Average Co-Inventor Count = 2.2

ph-index = 24

Forward Citations = 1,243(Granted Patents)


Company Filing History:


Years Active: 2004-2014

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40 patents (USPTO):Explore Patents

Title: Innovations of Reza-ur Rahman Khan in Ball Grid Array Packaging

Introduction: Reza-ur Rahman Khan, based in Rancho Santa Margarita, CA, is an accomplished inventor with an impressive portfolio of 40 patents. His work primarily focuses on the fields of thermally and electrically enhanced packaging solutions, making significant contributions to the electronics industry.

Latest Patents: Among his latest inventions is a patent for a "Thermally and electrically enhanced ball grid array package." This innovation details a method for assembling a ball grid array (BGA) package, which includes the use of a stiffener with specially designed surfaces that enhance the adhesiveness of encapsulant material. This configuration allows for improved mounting of integrated circuit (IC) dies.

Another noteworthy patent is for a "Ball grid array package enhanced with a thermal and electrical connector." This package integrates a substrate with developed surfaces, a stiffener attached to it, and a thermal connector designed to engage with a printed circuit board. These advancements promise to significantly enhance the performance and reliability of electronic assemblies.

Career Highlights: Reza-ur Rahman Khan's career has seen him work with prominent companies, notably Broadcom Corporation. His contributions in various capacities have helped to drive innovation within the organization and the broader technology landscape. Khan's expertise is reflected not only in his numerous patents but also in his ability to advance cutting-edge solutions in the field of electronics.

Collaborations: During his journey as an inventor, Khan has collaborated with esteemed colleagues, such as Sam Ziqun Zhao and Brent Bacher. These partnerships have played a crucial role in fostering innovation and refining the technologies associated with their projects.

Conclusion: Reza-ur Rahman Khan is a pioneering figure in the realm of ball grid array packaging who continues to drive innovation through his extensive patent portfolio. His contributions are shaping the future of electronic design and manufacturing, ensuring enhanced performance and reliability in various applications.

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