The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2010
Filed:
Sep. 29, 2004
Reza-ur Rahman Khan, Rancho Santa Margarita, CA (US);
Sam Ziqun Zhao, Irvine, CA (US);
Reza-ur Rahman Khan, Rancho Santa Margarita, CA (US);
Sam Ziqun Zhao, Irvine, CA (US);
Broadcom Corporation, Irvine, CA (US);
Abstract
A cavity or die down ball grid array package includes an interposer substrate structure attached to the die. In an example, the interposer substrate reduces the interconnect length from a board to which the package mounts to power and ground pads on a top layer of the semiconductor or integrated circuit (IC) die. In this example, the interposer substrate also removes the requirement that power and ground pads be located on a periphery of the die. Power and ground pads can be located in an interior region on a top metal layer where they can be interconnected to the interposer substrate using electrically conductive bumps or wire bond(s).