The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2011
Filed:
Oct. 29, 2008
Sam Ziqun Zhao, Irvine, CA (US);
Reza-ur Rahman Khan, Rancho Santa Margarita, CA (US);
Sam Ziqun Zhao, Irvine, CA (US);
Reza-ur Rahman Khan, Rancho Santa Margarita, CA (US);
Broadcom Corporation, Irvine, CA (US);
Abstract
Ball grid array (BGA) packages are provided. A BGA package includes a substrate that has a surface and a stiffener that has a surface and a protruding portion. The surface of the substrate has an opening therein. The protruding portion is located on the surface of the stiffener. The surface of the stiffener is coupled to the surface of the substrate. The protruding portion extends through the opening. An area of the surface of the stiffener is less than an area of the surface of the substrate. A surface of the protruding portion is capable of attachment to a printed circuit board (PCB) when the BGA package is mounted to the PCB.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile