The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2010
Filed:
Sep. 18, 2007
Sam Ziqun Zhao, Irvine, CA (US);
Reza-ur Rahman Khan, Rancho Santa Margarita, CA (US);
Sam Ziqun Zhao, Irvine, CA (US);
Reza-ur Rahman Khan, Rancho Santa Margarita, CA (US);
Broadcom Corporation, Irvine, CA (US);
Abstract
A flip chip package generally includes a substrate, a flip chip die, and a heat spreader. The flip chip die is coupled to the substrate. The heat spreader is coupled to the flip chip die. The heat spreader can include one or more walls. Generally, the one or more walls at least partially laterally surround the flip chip die and/or the substrate. The walls can completely laterally surround the flip chip die to define a cavity in the heat spreader. The flip chip package can further include an encapsulate. For example, the encapsulate can be injected between the one or more walls of the heat spreader and the flip chip die and/or other components of the flip chip package. The encapsulate and/or the one or more walls of the heat spreader can protect one or more components of the flip chip package against moisture, corrosives, heat, or radiation, to provide some examples.