The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 01, 2014

Filed:

Sep. 02, 2011
Applicants:

Sam Ziqun Zhao, Irvine, CA (US);

Reza-ur Rahman Khan, Rancho Santa Margarita, CA (US);

Edward Law, Tracy, CA (US);

Marc Papageorge, Pleasanton, CA (US);

Inventors:

Sam Ziqun Zhao, Irvine, CA (US);

Reza-ur Rahman Khan, Rancho Santa Margarita, CA (US);

Edward Law, Tracy, CA (US);

Marc Papageorge, Pleasanton, CA (US);

Assignee:

Broadcom Corporation, Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

In one embodiment, a method for assembling a ball grid array (BGA) package is provided. The method includes providing a stiffener that has opposing first and second surfaces, wherein the first surface is capable of mounting an integrated circuit (IC) die in a central area and forming a pattern in at least a portion of the first surface to enhance the adhesiveness of an encapsulant material to the first surface.


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