The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2011
Filed:
Jul. 23, 2010
Applicants:
Reza-ur Rahman Khan, Rancho Santa Margarita, CA (US);
Sam Ziqun Zhao, Irvine, CA (US);
Inventors:
Reza-Ur Rahman Khan, Rancho Santa Margarita, CA (US);
Sam Ziqun Zhao, Irvine, CA (US);
Assignee:
Broadcom Corporation, Irvine, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/58 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of forming a ball grid array (BGA) package is provided. The method includes coupling an integrated circuit (IC) die to a heat spreader in an opening of a substrate, the opening of the substrate extending through the substrate, such that a portion of the heat spreader is accessible through the opening and coupling a first surface of a second substrate to the IC die via a bump interconnect. The second surface of the second substrate has an array of contact pads capable of coupling to a board.