The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2009
Filed:
Oct. 31, 2005
Applicants:
Sam Z. Zhao, Irvine, CA (US);
Reza-ur R. Khan, Rancho Santa Margarita, CA (US);
Inventors:
Sam Z. Zhao, Irvine, CA (US);
Reza-ur R. Khan, Rancho Santa Margarita, CA (US);
Assignee:
Broadcom Corporation, Irvine, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
Methods, systems, and apparatuses for attaching heat sinks to integrated circuit packages using thermally conductive adhesive materials are described. The adhesive materials can be shaped to conform to surfaces of the integrated circuit package and/or heat sink, prior to hardening, such as by curing the adhesive material.
Zhao, Sam. (2009). Method and system for secure heat sink attachment on semiconductor devices with macroscopic uneven surface features (U.S. Patent No. 7566591). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7566591
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile