Rahul Agarwal

Title: Innovations of Rahul Agarwal

Introduction

Rahul Agarwal is a prominent inventor based in Santa Clara, CA. He has made significant contributions to the field of semiconductor technology, holding a total of 7 patents. His work has been instrumental in advancing the capabilities of semiconductor devices.

Latest Patents

One of his latest patents is for a semiconductor chip device. This invention includes a molding layer with a first side and a second side, an interconnect chip partially encased in the molding layer, and a through substrate via (TSV) that extends through the interconnect chip. Additionally, it features an insulating layer positioned on the first side of the molding layer and a conductive structure that is vertically below the interconnect chip, electrically coupled to the TSV. Another notable patent is for a molded semiconductor chip package with a stair-step molding layer. This package includes a routing substrate and a semiconductor chip mounted on it, with a molding layer that at least partially encases the semiconductor chip.

Career Highlights

Rahul has worked with leading companies in the technology sector, including Advanced Micro Devices Corporation and ATI Technologies. His experience in these organizations has allowed him to develop innovative solutions that enhance semiconductor performance and reliability.

Collaborations

Throughout his career, Rahul has collaborated with notable professionals in the industry, including Brett P. Wilkerson and Raja Swaminathan. These collaborations have contributed to the successful development of his patented technologies.

Conclusion

Rahul Agarwal's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His work continues to shape the future of semiconductor devices and their applications.