The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2024

Filed:

Sep. 27, 2019
Applicant:

Advanced Micro Devices, Inc., Santa Clara, CA (US);

Inventors:

Skyler J. Saleh, San Diego, CA (US);

Ruijin Wu, San Diego, CA (US);

Milind S. Bhagavat, Santa Clara, CA (US);

Rahul Agarwal, Santa Clara, CA (US);

Assignee:

Advanced Micro Devices, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); G06F 8/41 (2018.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 24/96 (2013.01); G06F 8/451 (2013.01); H01L 21/4846 (2013.01); H01L 21/563 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 24/19 (2013.01); H01L 24/97 (2013.01); H01L 25/50 (2013.01); H01L 2021/6006 (2013.01); H01L 25/0657 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/11002 (2013.01);
Abstract

Various multi-die arrangements and methods of manufacturing the same are disclosed. In some embodiments, a method of manufacture includes a face-to-face process in which a first GPU chiplet and a second GPU chiplet are bonded to a temporary carrier wafer. A face surface of an active bridge chiplet is bonded to a face surface of the first and second GPU chiplets before mounting the GPU chiplets to a carrier substrate. In other embodiments, a method of manufacture includes a face-to-back process in which a face surface of an active bridge chiplet is bonded to a back surface of the first and second GPU chiplets.


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