The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2025

Filed:

Dec. 28, 2021
Applicants:

Advanced Micro Devices, Inc., Santa Clara, CA (US);

Ati Technologies Ulc, Markham, CA;

Inventors:

Arsalan Alam, Austin, TX (US);

Fei Guo, Markham, CA;

Rahul Agarwal, Santa Clara, CA (US);

Assignees:

ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US);

ATI TECHNOLOGIES ULC, Markham, CA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2023.01); H01L 21/56 (2006.01); H01L 25/00 (2006.01); H01L 25/10 (2006.01); H01L 25/18 (2023.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 21/56 (2013.01); H01L 25/0652 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/08 (2013.01); H01L 24/80 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/80379 (2013.01); H01L 2224/80986 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/059 (2013.01);
Abstract

A semiconductor device includes a power delivery device die stack including a plurality of vertically arranged power delivery device dies. The plurality of power delivery device dies including at least a first power delivery device die and a second power delivery device die electrically connected to the first power delivery device die. The semiconductor device includes at least one external interconnect for providing a power input to the power delivery device die stack and at least one external interconnect for supplying a power output from the power delivery device die stack.


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